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Power chips are attached to external circuits through product packaging, and their efficiency depends upon the support of the product packaging. In high-power situations, power chips are generally packaged as power components. Chip affiliation refers to the electrical connection on the upper surface area of the chip, which is usually light weight aluminum bonding cord in standard modules. ^
Conventional power component package cross-section

At present, commercial silicon carbide power components still mainly utilize the packaging modern technology of this wire-bonded traditional silicon IGBT component. They encounter troubles such as large high-frequency parasitic parameters, inadequate warm dissipation ability, low-temperature resistance, and not enough insulation strength, which restrict using silicon carbide semiconductors. The display of outstanding performance. In order to address these problems and fully make use of the significant possible benefits of silicon carbide chips, numerous brand-new packaging technologies and solutions for silicon carbide power modules have arised in recent years.

Silicon carbide power component bonding approach

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have actually developed from gold cable bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually developed from gold wires to copper wires, and the driving force is expense reduction; high-power tools have developed from aluminum wires (strips) to Cu Clips, and the driving force is to boost item performance. The better the power, the higher the demands.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that makes use of a strong copper bridge soldered to solder to link chips and pins. Compared to typical bonding product packaging techniques, Cu Clip modern technology has the following advantages:

1. The link in between the chip and the pins is made from copper sheets, which, to a specific degree, changes the basic cable bonding approach in between the chip and the pins. For that reason, a special plan resistance worth, higher present flow, and far better thermal conductivity can be gotten.

2. The lead pin welding area does not need to be silver-plated, which can totally save the cost of silver plating and inadequate silver plating.

3. The item appearance is entirely regular with regular items and is mostly utilized in servers, portable computer systems, batteries/drives, graphics cards, electric motors, power materials, and other areas.

Cu Clip has 2 bonding approaches.

All copper sheet bonding approach

Both eviction pad and the Resource pad are clip-based. This bonding technique is a lot more costly and complex, but it can achieve much better Rdson and better thermal effects.

( copper strip)

Copper sheet plus cord bonding technique

The source pad uses a Clip method, and eviction uses a Wire approach. This bonding approach is somewhat less expensive than the all-copper bonding technique, saving wafer location (suitable to really tiny gateway areas). The process is less complex than the all-copper bonding method and can acquire better Rdson and far better thermal effect.

Distributor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper buyers near me, please feel free to contact us and send an inquiry.

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